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Grinding Ic Chemical Engineering

Grinding Ic Chemical Engineering

Chemical Mechanical Planarization CMP is a polishing process that planarizes a surface at both a local and global scale. The multi scale planarization capabilities of CMP are used extensively in the fabrication of Integrated Circuits IC. Though a relentless reduction of feature scales have driven a continual refinement of the CMP process defectivity levels remain problematic in current .

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